• International Journal of Technology (IJTech)
  • Vol 17, No 4 (2026)

Implementation of a Cost-Effective 28-GHz Class-ABPower Amplifier in 180-nm Complementary Metal–Oxide–Semiconductor (CMOS) Technology for Next-Generation 5G Industrial Internet of Things Applications

Implementation of a Cost-Effective 28-GHz Class-ABPower Amplifier in 180-nm Complementary Metal–Oxide–Semiconductor (CMOS) Technology for Next-Generation 5G Industrial Internet of Things Applications

Title: Implementation of a Cost-Effective 28-GHz Class-ABPower Amplifier in 180-nm Complementary Metal–Oxide–Semiconductor (CMOS) Technology for Next-Generation 5G Industrial Internet of Things Applications
Abdulmunam Abtan, Sirous Toofan, Ziaddin Daie Kuzekan, Mohammed Zahim

Corresponding email:


Cite this article as:
Abtan, A., Toofan, S., Kuzekan, Z. D., & Hasan, M. Z. (2026). Implementation of a cost-effective 28-ghz class-ab power amplifier in 180-nm complementary metal–oxide–semiconductor (CMOS) technology for next-generation 5G industrial internet of things applications. International Journal of Technology, 17 (4), 1308–1319


4
Downloads
Abdulmunam Abtan Faculty of Electrical and Computer Engineering, University of Tabriz, 29 Bahman Blvd, Tabriz, 51666-16471, Iran
Sirous Toofan Faculty of Electrical and Computer Engineering, University of Tabriz, 29 Bahman Blvd, Tabriz, 51666-16471, Iran
Ziaddin Daie Kuzekan Faculty of Electrical and Computer Engineering, University of Tabriz, 29 Bahman Blvd, Tabriz, 51666-16471, Iran
Mohammed Zahim Faculty of Electrical and Computer Engineering, University of Tabriz, 29 Bahman Blvd, Tabriz, 51666-16471, Iran
Email to Corresponding Author

Abstract
Implementation of a Cost-Effective 28-GHz Class-ABPower Amplifier in 180-nm Complementary Metal–Oxide–Semiconductor (CMOS) Technology for Next-Generation 5G Industrial Internet of Things Applications

Industrial Internet of Things (IIoT) deployments demand cost-effective millimeter wave solutions that balance performance with economic viability. Despite advancements in high-frequency circuit design, a critical gap remains in the literature regarding quantitative cost-benefit frameworks and system-level validation for large-scale IIoT deployments, where unit economics often outperform peak RF performance. This study presents a two-stage Class-AB power amplifier operating at 28 GHz, implemented in the mature 180 nm CMOS technology. The design addresses the critical gap between high-performance advanced-node solutions and stringent cost constraints of large-scale industrial wireless sensor networks, a gap inadequately addressed in the prior literature, which has focused predominantly on performance optimization rather than cost-performance trade-offs for IIoT deployment. We employed T-type impedance matching networks combined with reverse body biasing to achieve competitive linearity while maintaining fabrication economy. An extensive, multi-tier Advanced Design System (ADS) simulation—including small-signal, large-signal harmonic balance, and system-level 5G NR waveform analysis—demonstrates a saturated output power of 13.43 dBm, peak power-added efficiency of 19.35%, and 3-dB bandwidth spanning 4 GHz. The amplifier maintains unconditional stability (K > 1.3,  > 1.2) and satisfies the 5G New Radio (NR) specifications with an error vector magnitude (EVM) below 8% and an adjacent channel leakage ratio (ACLR) better than -25 dBc. Through comprehensive cost-benefit analysis and benchmarking against eight state-of-the-art designs, we demonstrate that 180-nm CMOS offers a viable cost-optimized path for IIoT applications where 60% die-cost reduction justifies moderate performance trade-offs, achieving a normalized Figure of Merit (FoM) of 0.19 that outperforms prior mature-node implementations.

5G millimeter-wave; Class-AB power amplifier; CMOS technology; Cost-effective design; Industrial Internet of Things (IIoT)

Supplementary Material
FilenameDescription
R2-EECE-8451-20260518003003.docx ---
References

5G-ACIA. (2019). 5G for connected industries and automation (2nd) [5G Alliance for Connected Industries and Automation, viewed 2019]. https://5g-acia.org/whitepapers/5g-for-connected-industries-and-automation-second-edition/

5G-ACIA. (2021). 5G non-public networks for industrial scenarios [5G Alliance for Connected Industries and Automation, viewed 2021]. https://5g-acia.org/whitepapers/5g-non-public-networks-for-industrial-scenarios/

Afrin, S., Rafa, S. J., Kabir, M., Farah, T. A., Alam, M. S. B., & Lameesa, A. (2025). Industrial internet of things: Implementations, challenges, and potential solutions across various industries. Computers in Industry, 170, 104317. https://doi.org/10.1016/j.compind.2025.104317

Baek, J., Ibrahim, Y., Braganza, R. J., & Niknejad, A. M. (2025). A symbol-based power-tracking supply modulator integrated with a 28-GHz CMOS PA for 5G FR2. IEEE Journal of Solid-State Circuits, 60(12), 1–xx. https://doi.org/10.1109/JSSC.2025.3606814

Bennett, H. S., Pekarik, J. J., & Huang, M. (2010). 2009 ITRS chapter: Radio frequency and analog/mixed-signal technologies for wireless communications [National Institute of Standards and Technology (NIST)].

Choi, Y. C., Bin, S., Hwang, K. C., Lee, K.-Y., & Yang, Y. (2024). 23.5–27.5 GHz band Doherty power amplifier integrated circuit using 28 nm bulk CMOS process based on dynamic power dividing network. Electronics, 13, 4190. https://doi.org/10.3390/electronics13214190

Cripps, S. C. (2002). Advanced techniques in RF power amplifier design. Artech House.

Du Preez, J., Sinha, S., & Sengupta, K. (2023). SiGe and CMOS technology for state-of-the-art millimeter-wave transceivers. IEEE Access, 11, 55596–55620. https://doi.org/10.1109/ACCESS.2023.3282079

Edwards, M. L., & Sinsky, J. H. (1992). A new criterion for linear 2-port stability using a single geometrically derived parameter. IEEE Transactions on Microwave Theory and Techniques, 40(12), 2303–2311. https://doi.org/10.1109/22.179894

Europractice IC. (2019). TSMC 0.18 ?m, 0.13 ?m–90 nm, 65 nm, 40 nm, 28 nm CMOS [imec, viewed 2019]. https://europractice-ic.com/wp-content/uploads/2019/06/TSMC2019

Ghafari, F., Shourangiz, E., & Wang, C. (2024). Cost effectiveness of the industrial internet of things adoption in U.S. manufacturing SMEs. Intelligent and Sustainable Manufacturing, 1, 10008. https://doi.org/10.35534/ism.2024.10008

Hamid, S. S., Mariappan, S., Rajendran, J., Rawat, A. S., Rhafor, N. A., & Kumar, N. (2023). A state-of-the-art review on CMOS radio frequency power amplifiers for wireless communication systems. Micromachines, 14, 1551. https://doi.org/10.3390/mi14081551

Hasan, A. F., Murad, S. A. Z., Bakar, F. A., & Zulki, T. Z. A. (2019). A 28 GHz 0.18-?m CMOS cascade power amplifier with reverse body bias technique. TELKOMNIKA, 17(4), 1859–1866. https://doi.org/10.12928/TELKOMNIKA.v17i4.12761

Hasan, A. F., Murad, S. A. Z., Bakar, F. A., & Zulki, T. Z. A. (2020). A 28 GHz high efficiency fully integrated 0.18 ?m combined CMOS power amplifier using power divider technique for 5G millimeter-wave applications. Bulletin of Electrical Engineering and Informatics, 9(2), 644–651. https://doi.org/10.11591/eei.v9i2.1854

Jang, S., Kim, H., & Park, C. (2024). Ka-band CMOS stacked-FET power amplifier with pre-distorted driver stage for 5G applications. IEEE Access, 12, 1–xx. https://doi.org/10.1109/ACCESS.2024.3438463

Kang, S. (2016). Technical Report No. UCB/EECS-2016-19 (Tech. Rep.) [viewed 2016]. University of California, Berkeley. http://www.eecs.berkeley.edu/Pubs/TechRpts/2016/EECS-2016-19.html

Knometa Research LLC. (2024). Global Wafer Capacity 2024 [viewed 2024]. https://knometa.com/services/reports/

Kumar, A., Soh, P. J., & Kumar, A. (2022). Design consideration, challenges and measurement aspects of 5G mm-wave antennas: A review. Progress In Electromagnetics Research B, 96, 39–66. https://doi.org/10.2528/pierb22052002

Kumar, V., & Park, M. (2012). A 24 GHz CMOS power amplifier using reversed body bias technique. Science of Advanced Materials, 4, 1–xx. https://doi.org/10.1166/sam.2012.4567 

Lee, M., Yang, J., Lee, J., & Park, C. (2024). Design techniques for wideband CMOS power amplifiers for multi-band and multi-standard wireless communications. Electronics, 13(9), 1695. https://doi.org/10.3390/electronics13091695

Li, L., & Zhang, Z. (2025). A 28 GHz transformer-based Doherty power amplifier for FR2 5G applications in 40 nm CMOS. International Journal of Electronics, 112(3), 1–xx. https://doi.org/10.1080/00207217.2024.2312557

Liu, Z., Chen, X., Wu, H., Wang, Z., & Chen, X. (2025). Integrated sensing and edge AI: Realizing intelligent perception in 6G. Microwave and Optical Technology Letters. https://doi.org/10.48550/arXiv.2501.06726

Luo, J., Shen, Y., & Peng, Y. (2024). An 18–33 GHz CMOS LNA with 26.7 dB peak gain and 2.8 dB minimum NF for K/Ka-band applications. AEU – International Journal of Electronics and Communications, 177, 155175. https://doi.org/10.1016/j.aeue.2024.155175

Mayeda, J., Lie, D. G., & Lopez, J. (2022). Broadband millimeter-wave 5G power amplifier design in 22 nm CMOS FD-SOI and 40 nm GaN HEMT. Electronics, 11(5), 683. https://doi.org/10.3390/electronics11050683

Park, M., & Kumar, V. (2021). A 3.5 GHz hybrid CMOS Class E power amplifier with reverse body bias design for 5G applications. AIP Conference Proceedings, 2339, 1–xx. https://doi.org/10.1063/5.0182394

Pozar, D. M. (2000). Microwave and RF Design of Wireless Systems. John Wiley & Sons.

Pozgar, G., & Tarasiuk, S. (2017). Stability analysis and design guidelines for broadband amplifiers. IET Microwaves, Antennas & Propagation, 11(15), 2067–2076. https://doi.org/10.1049/iet-map.2017.0456

Qualcomm. (2026). How 5G Will Transform Industrial IoT: Private 5G Networks and Edge AI for Next-Generation Automation [Qualcomm Technologies, Inc., viewed 2026]. https://www.qualcomm.com/research/5g/5g-industrial-iot

Rüddenklau, U., Geen, M., Pallotta, A., Barrett, M., Wambacq, P., & Sellars, M. (2018). mmWave semiconductor industry technologies: Status and evolution (2nd) [ETSI White Paper No. 15]. ETSI.

Sun, N.-Z., Gao, L., Zeng, W., Hu, J., Liu, X., & Zhang, X. Y. (2025). A balanced power amplifier with complementary adaptive bias in 28-nm bulk CMOS for 5G millimeter-wave systems. IEEE Transactions on Circuits and Systems II: Express Briefs, 72(1), 1–xx. https://doi.org/10.1109/TCSII.2024.3480706

Taiwan Semiconductor Manufacturing Company (TSMC). (2026). 0.18 ?m technology (logic platform) [TSMC website, viewed 26 February 2026]. https://www.tsmc.com/english/

Wang, X., Guo, B., Wu, J., & Gong, J. (2020). A 28 GHz front-end for phased array receivers simulated in 180 nm CMOS. IEEE International Conference on Semiconductor Electronics (ICSE). https://doi.org/10.1016/j.asej.2023.10236

Xie, K., Wang, K., & Zhang, H. (2023). A two-way three-stage W-band power amplifier with series–parallel inductor-based T-type inter-stage matching network. Microelectronics Journal, 135, 105770. https://doi.org/10.1016/j.mejo.2023.105770

Yang, Y., Mao, M., Xu, J., Liu, H., Wang, J., & Song, K. (2025). Millimeter-wave antennas for 5G wireless communications: Technologies, challenges, and future trends. Sensors, 25, 5424. https://doi.org/10.3390/s25175424

Yue, P., & Rodwell, M. (2006). Mm-Wave IC design: The transition from III–V to CMOS circuit techniques [IEEE CSIC Short Course].

Zeng, W., Gao, L., Sun, N., Xu, H., Xue, Q., & Zhang, X. (2023). A 19.7-to-43.8-GHz power amplifier with broadband linearization technique in 28-nm bulk CMOS. 2023 IEEE International Solid-State Circuits Conference (ISSCC). https://doi.org/10.1109/ISSCC42615.2023.10067840

Zeng, W., Gao, L., Sun, N.-Z., Li, H.-Y., Xu, J.-X., & Xu, H. (2024). A compact 19.7- to 43.8-GHz power amplifier with 20.3-dBm Psat and 35.5% PAE in 28-nm bulk CMOS. IEEE Journal of Solid-State Circuits, 59(8), 1–xx. https://doi.org/10.1109/JSSC.2024.3364096

Zhao, Y., Hou, H., Zhang, S., Wang, H., & Chang, S. (2023). A 28-GHz wideband power amplifier with dual-pole tuning superposition technique in 55-nm RF CMOS. Integration, 83, 101–107. https://doi.org/10.1016/j.vlsi.2022.09.004

Zheng, W., Deng, W., Gong, J., Jia, H., Li, D., & Wu, H. (2025). A 22-to-50 GHz bi-directional beamforming CMOS front-end with distributed impedance reshaping technique for 5G NR FR2 applications. 2025 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 135–138. https://doi.org/10.1109/RFIC61188.2025.11082867