Cascade Straight Heat Pipe for Computer Cooling System with Nanofluid
Corresponding email: wayan.nata@unud.ac.id
Published at : 16 Dec 2019
Volume : IJtech
Vol 10, No 8 (2019)
DOI : https://doi.org/10.14716/ijtech.v10i8.3634
Septiadi, W.N., Wulandari, I.G.A.A.D., Murti, M.R., Ula, W.A.W., Widiantara, I.K.O., Widyantara, I.W.G., David Febraldo., 2019. Cascade Straight Heat Pipe for Computer Cooling System with Nanofluid. International Journal of Technology. Volume 10(8), pp. 1635-1642
| Wayan Nata Septiadi | 1. Department of Mechanical Engineering, Faculty of Engineering, Udayana University, Jalan Raya Kampus Unud, Jimbaran, Badung, Bali 80361, Indonesia 2. Heat Transfer Laboratory, Department of Mechani |
| I Gusti Agung Ayu Desy Wulandari | Department of Mechanical Engineering, Faculty of Engineering, Udayana University, Jalan Raya Kampus Unud, Jimbaran, Badung, Bali 80361, Indonesia |
| Made Ricki Murti | 1. Department of Mechanical Engineering, Faculty of Engineering, Udayana University, Jalan Raya Kampus Unud, Jimbaran, Badung, Bali 80361, Indonesia 2. Heat Transfer Laboratory, Department of Mechani |
| Wayan Ainun Wildan Ula | Department of Mechanical Engineering, Faculty of Engineering, Udayana University, Jalan Raya Kampus Unud, Jimbaran, Badung, Bali 80361, Indonesia |
| I Kadek Odik Widiantara | Department of Mechanical Engineering, Faculty of Engineering, Udayana University, Jalan Raya Kampus Unud, Jimbaran, Badung, Bali 80361, Indonesia |
| I Wayan Gede Widyantara | Department of Mechanical Engineering, Faculty of Engineering, Udayana University, Jalan Raya Kampus Unud, Jimbaran, Badung, Bali 80361, Indonesia |
| David Febraldo | Department of Mechanical Engineering, Faculty of Engineering, Udayana University, Jalan Raya Kampus Unud, Jimbaran, Badung, Bali 80361, Indonesia |
Computer Central Processing
Unit (CPU) technology is being developed rapidly for better work performance
together with smaller size. This technology development produces significant
heat flux increase on the processor. In this paper, a cascade straight heat
pipe (CSHP) is created for a better CPU cooling system which is a fully passive
system using nanofluids and hybrid nanofluid as the working fluid. Heat loads
were given to the CSHP at 10 watts, 20 watts, 30 watts, and 40 watts,
respectively. Based on the experiment’s result, the CSHP with Al2O3-TiO2-water
working fluid showed the best performance, decreasing 41.872% of the simulator
plate temperature at maximum load while also having the highest condenser
output temperature. The CSHP with Al2O3-water working
fluid decreased 35.243% of the simulator plate temperature. The CSHP with water
working fluid decreased only 28.648% of the simulator plate temperature and had
the lowest condenser output temperature. The CSHP with Al2O3-TiO2-water showed the lowest thermal resistance and the highest coefficient of heat
transfer.
Heat pipe; Heat transfer; Nanofluid
The
progress of technological developments for the last few decades can be seen in
several fields (electronics, power generation, etc.) (Ranga Babu et al., 2017).
Smart technologies have rapidly developed, applying scientific knowledge for
practical purposes with an evolutionary process, especially in computer
hardware technology, as a solution to facilitate and improve the performance of
human work (Brenner, 2007).
Central Processing Units (CPUs), the core of a computerized system, are experiencing rapid technology development (Paiva & Mantelli, 2015). The development of CPU technology leads to smart technology with the dimension decrease and has higher performance (Chen & Huang, 2017). However, this makes the CPU heat flux increase significantly (Elnaggar et al., 2011). The need for a high-performance cooling system with small dimensions without any additional power needs is a major issue faced by the computer industry (Elnaggar et al., 2011; Liu et al., 2015). Many solutions have been created to overcome CPU heat flux management problems, as in the conventional way by the application of forced convection heat transfer (Elnaggar et al., 2011). However, the conventional method is less efficient in removing heat, especially on smaller sized devices, because it requires higher power to support the fan performance.
Heat pipe is a
heat transfer technology that uses a pipe (commonly made of copper, aluminum,
etc.) containing liquid as a heat conductor from the end of the evaporator to
the other end of the cooling section (heat removed) (Gupta et al., 2018). The
heat pipe’s inner wall is filled with capillary axis (wick) as transferring
media to return the condensate. Condensate moves by the principle of
capillarity (Putra & Septiadi, 2014). Various types of heat pipe have been
investigated, such as Heat Pipe Heat Exchanger (HPHE) and Oscillating Heat Pipe
(Muhammaddiyah et al., 2018; Winarta et al., 2019).
Research on using
heat pipes as processor cooling systems began in 2003 to 2014 (Kim et al.,
2003) with a study of Pentium IV CPU PC cooling system performance using
aluminum heat sink with fan assistance has disadvantages (shapes, noise
generated from the fan causing noise and ineffective heat transfer), so that
heat pipe as cooling system which is smaller than heatsink does not need to use
a fan for a support.
Cascade heat pipe
(CHP) is a heat pipe design that has multilevel construction, combining two heat
pipes into one system (Putra et al., 2015). The oscillating heat pipe (OHP) is
an up-and-coming passive thermal transfer device that transports heat through
the thermally excited oscillating motions of a working fluid.
Limited energy and
material resources as well as undesirable man-made climate change make science
seek for new and innovative strategies to save, transfer, and store heat energy
(Buschmann, 2013). In recent years, conventional heat transfer fluids have been
replaced by more advanced fluids for better heat transfer (Madhesh &
Kalaiselvam, 2014). Various studies of heat pipe application as a cooling
system have been conducted using nanofluid as a working fluid, including one by
Putra et al. (2014).
A study
investigated the synthesis of ZnO nanoparticle-based thermal fluids as the
working medium for a conventional heat pipe with screen-mesh wick. The
experiments were performed to measure the and heat pipe thermal resistances.
The results showed distribution of temperature and thermal resistance to
decrease as the concentration and the crystallite size of the nanoparticle
increased (Saleh et al., 2013).
Putra et al.
conducted a study employing a collar application as a wick on an LHP using
nanofluid as the working fluid. With the collar wick, the temperature
differences in the heat absorber with condenser sections were less than in the
one that used the sintered copper powder wick. Working fluids of nanofluids
resulted in lower temperature differences than using water-based working fluid;
i.e., the thermal resistance of the LHP was lowered by using the collar wick
and nanofluids (Putra et al., 2014).
Ahlatli et al. (2016)
conducted an experimental study of the thermal performance of carbon nanotube
nanofluids in solar microchannel collectors. They investigated the effects of
pumping power, heat transfer, and pressure drop on the heat and flow
characteristics of nanofluid. The results showed that as the weight of
nanofluids increased, the measured heat transfer, pump power, and pressure drop
increased.
Septiadi et al. (2018) conducted a study synthesizing two nanoparticles to
create hybrid nanofluids. The study determined how nanoparticle composition
affects the thermal conductivity value with the lowest agglomeration value.
This research was conducted by dispersing Al2O3-TiO2
nanoparticles in water.
The cascade straight heat pipe or CSHP-based CPU
cooling system with the best cooling performance in this study was the system
using Al2O3-TiO2-water working fluid, which reduced
41.872% of the simulator plate temperature and had the lowest condenser output
temperature. The second-best performance was in the use of Al2O3-water
working fluid, which decreased 35.243% of the simulator plate temperature,
while the poorest cooling system was in the use of water, which decreased
28.648% of the simulator plate temperature. The lowest thermal resistance given
by CSHP at each heat loading was in the use of Al2O3-TiO2-water
working fluid, and the coefficient of heat transfer given by Al2O3-TiO2-water
use was the highest. These findings show that Al2O3-TiO2-water
hybrid nanofluid working fluid gives the best cooling performance of the CSHP
for CPU cooling system.
The authors gratefully acknowledge the Ministry
of Technology and Higher Education and the Udayana Institute for Research and
Community Service for financial support through the 2019 Higher Education
Primary Research Grant (PTUPT) scheme with Contract Number
492.29/UN14.4.A/LT/2019.
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