• International Journal of Technology (IJTech)
  • Vol 6, No 6 (2015)

Seedless-electroplating Process Development for Micro-features Realization

Seedless-electroplating Process Development for Micro-features Realization

Title: Seedless-electroplating Process Development for Micro-features Realization
Yudan Whulanza, Tito Sitanggang, Jos Istiyanto, Sugeng Supriadi

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Published at : 30 Dec 2015
Volume : IJtech Vol 6, No 6 (2015)
DOI : https://doi.org/10.14716/ijtech.v6i6.1724

Cite this article as:

Whulanza, Y., Sitanggang, T., Istiyanto, J., Supriadi, S., 2015. Seedless-electroplating Process Development for Micro-features Realization. International Journal of Technology. Volume 6(6), pp. 1050-1056



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Yudan Whulanza Department of Mechanical Engineering, Faculty of Engineering, Universitas Indonesia, Kampus Baru UI Depok, Depok 16424, Indonesia
Tito Sitanggang Department of Mechanical Engineering, Faculty of Engineering, Universitas Indonesia, Kampus Baru UI Depok, Depok 16424, Indonesia
Jos Istiyanto Department of Mechanical Engineering, Faculty of Engineering, Universitas Indonesia, Kampus Baru UI Depok, Depok 16424, Indonesia
Sugeng Supriadi Department of Mechanical Engineering, Faculty of Engineering, Universitas Indonesia, Kampus Baru UI Depok, Depok 16424, Indonesia
Email to Corresponding Author

Abstract
Seedless-electroplating Process Development for Micro-features Realization

This study aims to combine the seedless-electroplating process with maskless-lithography, as an alternative for Lithografie, Galvanoformung, Abformung (LIGA) or Lithography, Electroplating and Molding with a normal, simpler, and cheaper semiconductor process with tolerable results for nickel electroplating. This study reports the results of various voltages on seedless-electroplating over time, where the optimal combination occurs at an exposure of 7.5 Volts of Direct Current (VDC) for 30 seconds. The thickness of electroplated metal is at a range of ±1.5µm. Moreover, a resolution of ±10µm and roughness (Ra) of ±0.31µm was achieved during the metal deposition process.

LIGA, Maskless-lithography, Seedless-electroplating, Wet chemical etching

References

Alfeeli, B., Zareian-Jahromi, M., Agah, M., 2009. Micro Preconcentrator with Seedless Electroplated Gold as Self-heating Adsorbent. In: Sensors, 2009 IEEE, pp. 1947–1950

Becker, E., Ehrfeld, W., Hagmann, P., Maner, A., Münchmeyer, D., 1986. Fabrication of Microstructures with High Aspect Ratios and Great Structural Heights by Synchrotron Radiation Lithography, Galvanoforming, and Plastic Moulding (LIGA process). Microelectronic Engineering, Volume 4(1), pp. 35–56

Chang, H.K., Kim, Y.K., 2000. UV-LIGA Process for High Aspect Ratio Structure using Stress Barrier and C-shaped Etch Hole. Sensors and Actuators A: Physical, Volume 84(3), pp. 342–350

Kumar, S., Greenslit, D., Chakraborty, T., Eisenbraun, E.T., 2009. Atomic Layer Deposition Growth of a Novel Mixed-phase Barrier for Seedless Copper Electroplating Applications. Journal of Vacuum Science & Technology A, Volume 27(3), pp. 572–576

Lee, J.Y., Lee, S.W., Lee, S.K., Park, J.H., 2013. Through-glass Copper via using the Glass Reflow and Seedless Electroplating Processes for Wafer-level RF MEMS Packaging. Journal of Micromechanics and Microengineering, Volume 23(8), pp. 1–10

Lee, S.K., Lee, K.C., Lee, S.S., 2002. A Simple Method for Microlens Fabrication by the Modified LIGA Process. Journal of Micromechanics and Microengineering, Volume 12(3), pp. 334–340

Llona, L.V., Jansen, H.V., Elwenspoek, M.C., 2006. Seedless Electroplating on Patterned Silicon. Journal of Micromechanics and Microengineering, Volume 16(6), pp. S1–S6

Saile, V., 2009. Introduction: LIGA and Its Applications, in LIGA and Its Applications (eds V. Saile, U. Wallrabe, O. Tabata and J. G. Korvink), Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, Germany, pp. 1–10

Starosvetsky, D., Sezin, N., Ein-Eli, Y., 2010. Seedless Copper Electroplating on Ta from a “Single” Electrolytic Bath. Electrochimica Acta, Volume 55(5), pp. 1656–1663

Suwandi, D., Whulanza, Y., Istiyanto, J., 2014. Visible Light Maskless Photolithography for Biomachining Application. Applied Mechanics and Materials, Volume 493, pp. 552–557

Zareian-Jahromi, M.A., Agah, M., 2009. Self-patterned Seedless Gold Electroplating in High-aspect-ratio Channels for ?GC Applications. In: Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS 2009. International, pp. 160–163