Vol 6, No 6 (2015) > Mechanical Engineering >

Seedless-electroplating Process Development for Micro-features Realization

Yudan Whulanza, Tito Sitanggang, Jos Istiyanto, Sugeng Supriadi



This study aims to
combine the seedless-electroplating
process with maskless-lithography, as an alternative for Lithografie, Galvanoformung, Abformung (LIGA) or Lithography, Electroplating and Molding with a normal, simpler, and cheaper semiconductor
process with tolerable
results for nickel electroplating. This study reports the results of various voltages on seedless-electroplating over time, where the optimal combination occurs at an
exposure of 7.5 Volts of Direct Current (VDC) for
30 seconds. The
thickness of electroplated metal is at a range of ±1.5µm. Moreover, a
resolution of ±10µm and roughness (Ra) of ±0.31µm was achieved during the metal deposition process.

Keywords: LIGA; Maskless-lithography; Seedless-electroplating; Wet chemical etching

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Alfeeli, B., Zareian-Jahromi, M., Agah, M., 2009. Micro Preconcentrator with Seedless Electroplated Gold as Self-heating Adsorbent. In: Sensors, 2009 IEEE, pp. 1947–1950

Becker, E., Ehrfeld, W., Hagmann, P., Maner, A., Münchmeyer, D., 1986. Fabrication of Microstructures with High Aspect Ratios and Great Structural Heights by Synchrotron Radiation Lithography, Galvanoforming, and Plastic Moulding (LIGA process). Microelectronic Engineering, Volume 4(1), pp. 35–56

Chang, H.K., Kim, Y.K., 2000. UV-LIGA Process for High Aspect Ratio Structure using Stress Barrier and C-shaped Etch Hole. Sensors and Actuators A: Physical, Volume 84(3), pp. 342–350

Kumar, S., Greenslit, D., Chakraborty, T., Eisenbraun, E.T., 2009. Atomic Layer Deposition Growth of a Novel Mixed-phase Barrier for Seedless Copper Electroplating Applications. Journal of Vacuum Science & Technology A, Volume 27(3), pp. 572–576

Lee, J.Y., Lee, S.W., Lee, S.K., Park, J.H., 2013. Through-glass Copper via using the Glass Reflow and Seedless Electroplating Processes for Wafer-level RF MEMS Packaging. Journal of Micromechanics and Microengineering, Volume 23(8), pp. 1–10

Lee, S.K., Lee, K.C., Lee, S.S., 2002. A Simple Method for Microlens Fabrication by the Modified LIGA Process. Journal of Micromechanics and Microengineering, Volume 12(3), pp. 334–340

Llona, L.V., Jansen, H.V., Elwenspoek, M.C., 2006. Seedless Electroplating on Patterned Silicon. Journal of Micromechanics and Microengineering, Volume 16(6), pp. S1–S6

Saile, V., 2009. Introduction: LIGA and Its Applications, in LIGA and Its Applications (eds V. Saile, U. Wallrabe, O. Tabata and J. G. Korvink), Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, Germany, pp. 1–10

Starosvetsky, D., Sezin, N., Ein-Eli, Y., 2010. Seedless Copper Electroplating on Ta from a “Single” Electrolytic Bath. Electrochimica Acta, Volume 55(5), pp. 1656–1663

Suwandi, D., Whulanza, Y., Istiyanto, J., 2014. Visible Light Maskless Photolithography for Biomachining Application. Applied Mechanics and Materials, Volume 493, pp. 552–557

Zareian-Jahromi, M.A., Agah, M., 2009. Self-patterned Seedless Gold Electroplating in High-aspect-ratio Channels for μGC Applications. In: Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS 2009. International, pp. 160–163