TY  - JOUR
T1  - Microstructural, Physical, and Mechanical Characteristics of Silver-Modified Tin–Copper–Zinc Lead-Free Solder Alloys
AU  - Andromeda Dwi Laksono,Gabriel Batistuta Pamurrung,Hizkia Alpha  Dewanto,Jatmoko Awali,Yee-wen Yen,Satoshi Iikubo,Gita Novian  Hermana,Turnad Lenggo  Ginta,Mavindra  Ramadhani
JO  - International Journal of Technology
VL  - 17
IS  - 2
SP  - 291
EP  - 319
PY  - 2026
DA  - 2026/03/31
SN  - 2087-2100
DO  - https://doi.org/10.14716/ijtech.v17i2.8271
UR  - https://ijtech.eng.ui.ac.id/article/view/8271