TY  - JOUR
T1  - Punch Force Behavior during Micro V-Bending Process of the Copper Foil
AU  - Gandjar Kiswanto,aida mahmudah,Dedi Priadi
JO  - International Journal of Technology
VL  - 8
IS  - 7
SP  - 291
EP  - 319
PY  - 2017
DA  - 2017/12/27
SN  - 2087-2100
DO  - https://doi.org/10.14716/ijtech.v8i7.747
UR  - https://ijtech.eng.ui.ac.id/article/view/747