• Vol 6, No 6 (2015)
  • Mechanical Engineering

Seedless-electroplating Process Development for Micro-features Realization

Yudan Whulanza, Tito Sitanggang, Jos Istiyanto, Sugeng Supriadi


Publish at : 01 Oct 2015 - 00:00
IJtech : IJtech Vol 6, No 6 (2015)
DOI : http://dx.doi.org/10.14716/ijtech.v6i6.1724

Cite this article as:
Whulanza, Y., Sitanggang, T., Istiyanto, J., Supriadi, S., 2015. Seedless-electroplating Process Development for Micro-features Realization. International Journal of Technology. Volume 6(6), pp.1050-1056
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Yudan Whulanza Department of Mechanical Engineering, Faculty of Engineering, Universitas Indonesia, Kampus Baru UI Depok, Depok 16424, Indonesia
Tito Sitanggang Department of Mechanical Engineering, Faculty of Engineering, Universitas Indonesia, Kampus Baru UI Depok, Depok 16424, Indonesia
Jos Istiyanto Department of Mechanical Engineering, Faculty of Engineering, Universitas Indonesia, Kampus Baru UI Depok, Depok 16424, Indonesia
Sugeng Supriadi Department of Mechanical Engineering, Faculty of Engineering, Universitas Indonesia, Kampus Baru UI Depok, Depok 16424, Indonesia
Email to Corresponding Author

Abstract

This study aims to combine the seedless-electroplating process with maskless-lithography, as an alternative for Lithografie, Galvanoformung, Abformung (LIGA) or Lithography, Electroplating and Molding with a normal, simpler, and cheaper semiconductor process with tolerable results for nickel electroplating. This study reports the results of various voltages on seedless-electroplating over time, where the optimal combination occurs at an exposure of 7.5 Volts of Direct Current (VDC) for 30 seconds. The thickness of electroplated metal is at a range of ±1.5µm. Moreover, a resolution of ±10µm and roughness (Ra) of ±0.31µm was achieved during the metal deposition process.

LIGA; Maskless-lithography; Seedless-electroplating; Wet chemical etching

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